Obtain accurate English translations of China's electronics and electronic components standards (GB/GB/T). Download printable PDFs, view online, or buy bulk licenses to meet the technical and safety requirements of your electronic engineering projects in China.
Testing Method for the Pad Cratering of Printed Circuit Board Assembly
Technical Specification of Ultra-High Definition Light Emitting Diode (LED) Display System
Technical Requirements for Ultra-High Definition Vehicle Video Displays
Performance Test Methods for Electronic Projectors
Measure Methods of Light Emitting Diode (LED) Displays
Specification for Semiconductor Laser Chip Used in Optical Fiber Communication - Part 4: Bragg Reflector Grating Tunable Semiconductor Laser Chip for Light Sources
Specification for Semiconductor Laser Chip Used in Optical Fiber Communication - Part 3: Electro-Absorption Modulated Semiconductor Laser Chip for Light Sources
Specification for Semiconductor Laser Chip Used in Optical Fiber Communication - Part 2: Vertical Cavity Surface Emitting Diode Laser Chip for Light Sources
Technical Specification of Semiconductor Laser Chip Used in Optical Fiber Communication
Portable Photovoltaic Panel
Specification for Semiconductor Laser Chip Used in Optical Fiber Communication - Part 1: Fabry-Perot and Distributed Feedback Semiconductor Laser Chip for Light Sources
