SJ/T 11856.3-2022 Part 3: EML Chip for Optical Fiber Communication Light Sources

Standard Catalog

The standard consists of the following main sections:

• 1 Scope 1

• 2 Normative References 1

• 3 Terms and Definitions 1

• 4 Abbreviations 2

• 5 Technical Requirements 2

• 5.1 Optoelectronic Characteristics 2

• 5.2 Chip Material 4

• 5.3 Surface Quality 4

• 5.4 Chip Dimensions 4

• 5.5 Shear Force and Gold-Wire Bonding Strength 4

• 5.6 ESDS Test Requirements 4

• 5.7 High-Temperature Storage 4

• 5.8 Low-Temperature Storage 4

• 5.9 Temperature Cycling 4

• 5.10 Steady Damp Heat 4

• 5.11 High-Temperature Life 4

• 5.12 Steady Damp Heat, Operating 4

• 6 Test Methods 5

• 6.1 Test Environmental Conditions 5

• 6.2 Test Instrument Requirements 5

• 6.3 Optoelectronic Characteristics 5

• 6.4 Physical Characteristics 6

• 6.5 Environmental Adaptability 7

• 7 Inspection Rules 7

• 7.1 Inspection Classification 7

• 7.2 Screening 7

• 7.3 Factory Inspection 8

• 7.4 Type Inspection 8

• 8 Packaging, Marking, Product Instructions and Storage 9

• 8.1 Packaging 9

• 8.2 Marking 10

• 8.3 Product Instructions 10

• 8.4 Storage 10

• 9 Other Requirements 10

• Appendix A Wavelength Allocation Tables 11

• A.1 DWDM Wavelength Allocation 11

• A.2 LWDM Wavelength Allocation 12

• A.3 CWDM Wavelength Allocation 12

• A.4 Wavelength Range for WDM Applications 13