SJ/T 11856.4-2025 Semiconductor Laser Chip Part 4: DBR Tunable Light Source Chip

Standard Catalog

The standard consists of the following main sections:

• 1 Scope 1

• 2 Normative References 1

• 3 Abbreviations, Symbols and Definitions 1

• 3.1 Abbreviations 1

• 3.2 Symbols 1

• 3.3 Definitions 1

• 4 Classification 2

• 5 Requirements 2

• 5.1 Absolute Maximum Ratings 2

• 5.2 Optoelectronic Characteristics 2

• 5.2.1 DBR Chip Optoelectronic Characteristics 2

• 5.2.2 EML Chip Optoelectronic Characteristics 3

• 5.3 Chip Material 4

• 5.4 Chip Dimensions 4

• 5.5 Surface Quality 4

• 5.6 ESDS 4

• 5.7 Gold-Wire Bonding Strength 4

• 5.8 Shear Force 4

• 5.9 High-Temperature Storage 4

• 5.10 Low-Temperature Storage 4

• 5.11 Temperature Cycling 4

• 5.12 Steady Damp Heat 4

• 5.13 High-Temperature Life 4

• 6 Inspection Rules 5

• 6.1 Inspection Classification 5

• 6.2 Composition of Inspection Lots 5

• 6.3 Quality Assessment Procedure 5

• 6.4 Screening 5

• 6.5 Qualification Inspection 6

• 6.6 Quality Conformance Inspection 7

• 7 Test Methods 8

• 7.1 Test Environmental Conditions 8

• 7.2 Test Instruments and Equipment 8

• 7.3 Optoelectronic Characteristics 8

• 7.3.1 Threshold Current 8

• 7.3.2 Forward Optical Power 8

• 7.3.3 Extinction Ratio 9

• 7.3.4 Modulation Bandwidth 9

• 7.3.5 Forward Gain Voltage 10

• 7.3.6 Forward Modulation Voltage 10

• 7.3.7 -20 dB Spectral Width 10

• 7.3.8 Channel Spacing 10

• 7.3.9 Side-Mode Suppression Ratio 11

• 7.3.10 Slope Efficiency 11

• 7.3.11 Wavelength Temperature Drift Coefficient 11

• 7.3.12 Relative Intensity Noise 11

• 7.3.13 Vertical Far-Field Angle 12

• 7.3.14 Horizontal Far-Field Angle 12

• 7.4 Chip Dimensions 12

• 7.5 Surface Quality 12

• 7.6 Environmental Adaptability 12

• 7.6.1 ESDS 12

• 7.6.2 Gold-Wire Bonding Strength 12

• 7.6.3 Shear Force 12

• 7.6.4 High-Temperature Storage 12

• 7.6.5 Low-Temperature Storage 12

• 7.6.6 Temperature Cycling 12

• 7.6.7 Steady Damp Heat 12

• 7.6.8 High-Temperature Life 12

• 8 Packaging and Storage 13

• 8.1 Packaging 13

• 8.1.1 Product and Packaging Marking 13

• 8.1.2 Product Instructions 13

• 8.2 Storage 13

• 9 Precautions 13

• Appendix A Wavelength Allocation Tables (Normative) 14

• A.1 DWDM (100 GHz) Wavelength Allocation 14

• A.2 DWDM (50 GHz) Wavelength Allocation 14