SJ/T 11997.1-2025 Laser Chip Photoelectric Test Methods Part 1
Test methods for semi-conductor laser chips of optical fibre communications Part 1: Basic photoelectric characteristics
Standard Details
SJ/T 11997.1-2025 (English Version)
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SJ/T 11997.1-2025 (Chinese Version)
- Chinese original version
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Standard Introduction
This standard was developed by Hebei Shenghao Optoelectronics Technology, CESI, CETC 13th Research Institute, and several leading chip makers including Hisense Broadband and Source Photonics. Effective November 2025, it sits within a broader family of standards that also cover VCSELs, electro-absorption modulated lasers, DFB tunable lasers, and pump lasers.
The document pays particular attention to laser safety, clean-room requirements, and data-processing formulas—details that matter when you need repeatable, comparable results across different labs and production batches.
Standard Catalog
The standard consists of the following main sections:
1 Scope 1
2 Normative References 1
3 Terms and Definitions 1
4 Symbols and Abbreviations 2
Symbols 2
Abbreviations 2
5 Test Conditions 3
Environmental Conditions 3
Test Instruments and Metrology Requirements 3
Laser Safety Requirements 3
Requirements for Normal Operation of Device Under Test 3
6 Test Methods 3
Electrical Characteristic Parameter Tests 3
6.1.1 Test Purpose 3
6.1.2 Test Principle 3
6.1.3 Test Steps 4
6.1.4 Data Processing 4
Spectral Characteristic Parameter Tests 17
6.2.1 Test Purpose 17
6.2.2 Test Principle 17
6.2.3 Test Steps 17
6.2.4 Data Processing 17
Divergence Angle Parameter Tests 23
6.3.1 Test Purpose 23
6.3.2 Test Principle 23
6.3.3 Test Steps 24
6.3.4 Data Processing 24
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