SJ/T 11856.1-2022 Specification for Semiconductor Laser Chip

Standard Catalog

The standard consists of the following main sections:

• 1 Scope 1

• 2 Normative References 1

• 3 Terms and Definitions 1

• 4 Abbreviations 2

• 5 Technical Requirements 3

• 5.1 Classification 3

• 5.2 Optoelectronic Characteristics 3

• 5.3 Chip Material 6

• 5.4 Surface Quality 6

• 5.5 Chip Dimensions 6

• 5.6 Shear Force and Bonding Strength 6

• 5.7 Electrostatic Discharge Sensitivity 6

• 5.8 High-Temperature Storage 6

• 5.9 Low-Temperature Storage 6

• 5.10 Temperature Cycling 6

• 5.11 Steady Damp Heat 6

• 5.12 High-Temperature Life 6

• 5.13 Steady Damp Heat, Operating 6

• 6 Test Methods 7

• 6.1 Test Environmental Conditions 7

• 6.2 Test Instruments 7

• 6.3 Optoelectronic Characteristics 7

• 6.4 Physical Characteristics 8

• 6.5 Environmental Adaptability 8

• 7 Inspection Rules 8

• 7.1 Inspection Classification 8

• 7.2 Screening 9

• 7.3 Factory Inspection 9

• 7.4 Type Inspection 9

• 8 Packaging, Marking, Product Instructions and Storage 11

• 8.1 Packaging 11

• 8.2 Marking 11

• 8.3 Product Instructions 11

• 8.4 Storage 11

• 9 Other Requirements 11

• Appendix A Wavelength Allocation Tables 12

• A.1 LWDM Wavelength Allocation 12

• A.2 MWDM Wavelength Allocation 12

• A.3 CWDM Wavelength Allocation 13

• A.4 Wavelength Range for WDM Applications 13