SJ/T 11402-2009 Optical Fiber Communication Laser Chip Spec

Standard Catalog

The standard consists of the following main sections:

• 1 Scope 1

• 2 Normative References 1

• 3 Abbreviations, Symbols and Definitions 1

• 3.1 Abbreviations 1

• 3.2 Terms, Symbols and Definitions 1

• 4 Requirements 1

• 4.1 Classification 1

• 4.2 Optoelectronic Characteristics 2

• 4.2.1 Absolute Maximum Ratings 2

• 4.2.2 Optoelectronic Technical Characteristics 2

• 4.3 Chip Material 4

• 4.4 Chip Dimensions 4

• 4.5 Surface Quality Requirements 4

• 4.6 Environmental Test Requirements 4

• 4.7 ESDS Test Requirements 4

• 4.8 High-Temperature Life Requirements 4

• 5 Inspection Rules 4

• 5.1 Inspection Classification 4

• 5.2 Composition of Inspection Lots 4

• 5.3 Quality Assessment Procedure 5

• 5.4 Screening 5

• 5.5 Qualification Inspection 5

• 5.6 Quality Conformance Inspection 6

• 6 Measurement and Test Methods 7

• 6.1 Standard Atmospheric Conditions for Measurement and Testing 7

• 6.2 Equipment and Instruments for Inspection 7

• 6.3 Optoelectronic Characteristic Measurement Methods 7

• 6.4 Chip Dimension Measurement Method 8

• 6.5 Surface Quality Inspection Method 8

• 6.6 Environmental Test Methods 8

• 6.7 ESDS Test Method 9

• 6.8 High-Temperature Life Test Method 9

• 7 Packaging and Storage 9

• 7.1 Packaging 9

• 7.2 Storage 9

• 8 Precautions 9